Varnitronics

PCB Assembly

From bare board to working board.

SMT, through-hole, and mixed assembly with inspection built into the line — from a single prototype to a recurring production schedule, turnkey or from your kit.

SMT and THT under one roof

Most real products are mixed-technology: fine-pitch SMT parts doing the thinking, through-hole connectors and power parts doing the heavy lifting. Our line handles both in one flow — solder paste printing, high-speed placement, reflow, then wave or selective soldering for the through-hole stage — so your board doesn't travel between vendors between steps.

Prototype and production run on the same processes. The board you validate at 5 pieces is built the same way at 5,000 — same paste, same profile, same inspection — which is exactly what makes scaling uneventful.

Testing that earns the word

AOI on every run

Automated optical inspection checks placement, polarity, and solder joints against your design data on every job — not just production runs.

X-ray & ICT where it matters

BGA and bottom-terminated packages get X-ray inspection on request; fixture-based in-circuit test is available for stable production volumes.

Functional test, your way

Bring your test procedure or ask us to help define one — boards can ship power-tested, firmware-flashed, and verified against your pass criteria.

Turnkey, consignment, or in between

Full turnkey

Send Gerbers and a BOM; receive finished, tested boards. We fabricate, source every component through vetted channels, assemble, and test.

Partial turnkey

You supply the critical, programmed, or long-lead parts; we source the rest and assemble. The most common model for production programs.

Consignment

You ship a complete kit; we assemble and test it. Full incoming-kit verification so shortages surface before the line starts, not during.

Assembly capabilities
SMT placementDown to 0201 passives; fine-pitch QFP, QFN, BGA
Through-holeWave & selective soldering, hand assembly for specials
Board formatsSingle boards & panels; rigid, MCPCB, flex (on carrier)
Solder processesLead-free (RoHS) & leaded, per your requirement
InspectionAOI on every run; X-ray for BGA on request
TestingFlying probe, in-circuit (fixture), functional test
Supply modelsFull turnkey, partial turnkey, consignment
VolumesPrototype (from 1 pc) to recurring production

Frequently asked questions

What's the difference between turnkey and consignment assembly?

Turnkey means Varnitronics handles everything — bare boards, component sourcing, and assembly — and you receive finished, tested boards. Consignment means you supply the components (a kit) and we assemble them. Partial turnkey mixes both: you supply the critical or long-lead parts, we source the rest.

What files do you need for PCB assembly?

Three things: your Gerber files, your bill of materials (BOM) with manufacturer part numbers, and pick-and-place (centroid) data. Assembly drawings and firmware/test instructions help for functional testing.

Can you assemble prototypes, or only production volumes?

Both. Prototype assembly starts from a single board — the same line, stencils, and AOI as production runs, so what you validate is what you'll ship at volume.

Do you handle fine-pitch BGA and 0201 components?

Yes — SMT placement covers 0201 passives and fine-pitch QFP/QFN/BGA packages, with X-ray inspection available to verify BGA solder joints.

Is lead-free (RoHS) assembly available?

Yes, lead-free is our default process. Leaded assembly is available where a legacy design or specific requirement calls for it.

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