Varnitronics
TE Connectivity

2-5499141-1

2.54mm Right Angle 10P Blue 5 2.54mm 2x5P 2 Through Hole Headers, Male Pins RoHS

Through HoleROHS3 CompliantActive
Manufacturer
TE Connectivity
Manufacturer part #
2-5499141-1
Store part #
C591630
Package / case
Through Hole
Packaging
Tray
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

8 in stock

#C591630

Stock & price checked 7 days ago

QuantityUnit pricePack price
1+₹1,142.33₹1,142.33
10+₹1,115.39₹11,153.90
30+₹1,097.57₹32,927.10
100+₹1,079.54₹1,07,954.00

1 × ₹1,142.33

₹1,142.33

excl. GST

₹1,347.95 incl. 18% GST

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  • GST invoice with every order
  • Standard pack: 1,944 per tray

2-5499141-1

₹1,142.33 for 1 + GST

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Specifications

Pitch
2.54mm
Connector Type
Right Angle
Flame Retardant Rating
UL94V-0
Contact Material
Brass
Number of PINs
10P
Plastic Material
Glass fiber reinforced PA66
Color
Blue
Number of PINs Per Row
5
X-Length of Bottom Edge on Board (Spacing Line)
32mm
Row Spacing
2.54mm
Pin Structure
2x5P
Number of Rows
2

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tray
Standard pack
1,944 / Tray
Sold per
Piece
Minimum order
1
Unit weight
0.03 g

Overview

For clarity, the pop-up latch is omitted from this view. See tables and notes on page 2. 1. Dimensioned coordinates apply from the basic position. The 10 and 14 pin sizes contain only one slot for a snap-in polarizer (polarization), located as shown. 3. The 10 pin size contains only one slot for dual polarization, located as shown. 4. Recommended PCB thickness is 1.57 [.062]. 5. Distance required for the ejector latch in the open position. Housing and latch: glass-filled nylon or polyester, UL94V-0 rated, color per table. Contacts: brass. 7. Contacts: flash gold over palladium-nickel plating, minimum total thickness 0.76μm [.000030] over selective plating area, minimum tin plating thickness 2.54μm [.000100] on solder tail, minimum nickel underplate thickness 1.27μm [.000050] over entire contact. Alternatively, minimum gold plating thickness 0.76μm [.000030] over selective plating area, minimum tin plating thickness 2.54μm [.000100] on solder tail, minimum nickel underplate thickness 1.27μm [.000050] over entire contact. Datums M and N are determined by the customer.

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