Varnitronics
AUIRF7640S2TR Infineon
Infineon

AUIRF7640S2TR

N-Channel 60V 21A 30W Surface Mount MG-WDSON-4

MG-WDSON-4ROHS3 CompliantActive

MOSFET N-CH 60V 21A MG-WDSON-4

Manufacturer
Infineon
Manufacturer part #
AUIRF7640S2TR
Store part #
C533283
Package / case
MG-WDSON-4
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

48 in stock

#C533283

Stock & price checked 3 days ago

QuantityUnit pricePack price
1+₹441.66₹441.66
10+₹434.06₹4,340.60
30+₹428.86₹12,865.80
100+₹423.66₹42,366.00

1 × ₹441.66

₹441.66

excl. GST

₹521.16 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 4,800 per reel

AUIRF7640S2TR

₹441.66 for 1 + GST

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Specifications

Operating Temperature
-55℃~+175℃
Drain to Source Voltage
60V
Current - Continuous Drain(Id)
21A
Ciss-Input Capacitance
450pF
Pd - Power Dissipation
30W
Reverse Transfer Capacitance (Crss)
48pF
RDS(on)
36mΩ@10V
Number
1 N-channel
Gate Charge(Qg)
11nC@30V
Gate Threshold Voltage (Vgs(th))
5V

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
4,800 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.158 g

Overview

The AUIRF7640S2TR/TR1 combines the latest automotive HEXFET® power MOSFET silicon technology with the advanced DirectFET® package platform, delivering a best-in-class solution for automotive Class D audio amplifier applications. When following the manufacturing methods and process guidelines described in application note AN-1035, the DirectFET® package is compatible with existing layout geometries, PCB assembly equipment, and vapor phase, infrared, or convection soldering techniques used in power applications. The DirectFET® package supports dual-side cooling to maximize thermal transfer efficiency in automotive power systems. This HEXFET® power MOSFET is optimized for gate charge, body diode reverse recovery, and internal gate resistance to improve key performance metrics of Class D audio amplifiers, including efficiency, total harmonic distortion (THD), and EMI. Furthermore, compared to conventional wire-bond SOIC packages, the DirectFET® package platform features lower parasitic inductance and resistance, improving EMI performance by reducing voltage ringing associated with current transients. These characteristics make this MOSFET an ideal component for automotive Class D audio amplifiers and other high-speed switching systems.

Applications

  • Automotive Class-D audio amplifiers
  • Other high-speed switching systems

Key features

  • Optimized for Class D audio amplifiers and high-speed switching applications
  • Low on-resistance Rds(on) for improved efficiency
  • Low gate charge Qg for improved THD and efficiency
  • Low reverse recovery charge Qrr for improved THD and reduced EMI
  • Low parasitic inductance for reduced ringing and EMI
  • Up to 100W output power per channel into 8Ω load
  • Dual-side cooling
  • Operating temperature up to 175°C
  • Repetitive avalanche capability for robustness and reliability
  • Lead-free, RoHS compliant, and halogen-free
  • Automotive-grade qualified

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