CL21B104KBCNNNC

The Samsung Electro-Mechanics CL21B104KBCNNNC is a multilayer ceramic chip capacitor (MLCC) with a nominal capacitance of 100nF (0.1µF) and a ±10% capacitance tolerance, identified by the "K" code in the part number. It is rated for a maximum DC working voltage of 50V and uses an X7R Class II ceramic dielectric. The capacitor employs nickel (Ni) internal electrodes with lead-free Ni/Cu/Ni barrier/Sn terminations, making it suitable for standard surface-mount assembly and general-purpose decoupling, bypass, filtering, and coupling applications.

The CL21B104KBCNNNC is supplied in the 2012 metric (0805 imperial) surface-mount package. Its nominal body dimensions are 2.00mm × 1.25mm, with a nominal thickness of 0.85mm and a maximum thickness of 0.95mm, in accordance with the manufacturer's dimensional specifications. The standardized 0805 footprint supports compatibility with common SMT assembly processes and industry-standard PCB land patterns, making the capacitor suitable for compact electronic designs across a wide range of applications.

he CL21B104KBCNNNC uses an X7R Class II ceramic dielectric, which maintains its capacitance characteristic within ±15% over an operating temperature range of −55°C to +125°C. This temperature characteristic makes X7R capacitors well suited for general-purpose decoupling, bypass, filtering, and coupling applications where moderate capacitance variation over temperature is acceptable. Designers should evaluate the capacitor's electrical characteristics against the requirements of their specific application and operating conditions.

The CL21B104KBCNNNC is commonly used as a bypass, decoupling, filtering, or coupling capacitor in digital and analog electronic circuits. A 100nF MLCC is frequently placed close to the power pins of integrated circuits to help reduce high-frequency noise and improve local power-supply stability. Typical applications include memory modules, DC-DC converters, display equipment, desktop computers, portable consumer electronics, communication equipment, and embedded electronic systems, consistent with the manufacturer's general application guidance.

The CL21B104KBCNNNC is designed for automated surface-mount assembly using a standard 0805 PCB footprint. Manufacturers should follow the recommended PCB land pattern and lead-free reflow soldering profile, with a peak reflow temperature of 260°C (+0/−5°C) in accordance with Samsung Electro-Mechanics process guidance. After soldering, excessive PCB bending or mechanical flexing should be avoided because mechanical stress can crack the ceramic body and affect long-term reliability.