DF2B5SL,L3F
14VC Clamp 5.5A@8/20us Ipp ESD DIODE SMD
- Manufacturer
- TOSHIBA
- Manufacturer part #
- DF2B5SL,L3F
- Store part #
- C1975121
- Package / case
- SMD
- Category
- TVS Diodes
- Packaging
- Tape & Reel (TR)
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement · policy
795 in stock
#C1975121
Stock & price checked 4 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 5+ | ₹11.96 | ₹59.80 |
| 50+ | ₹11.76 | ₹588.00 |
| 150+ | ₹11.63 | ₹1,744.50 |
| 500+ | ₹11.50 | ₹5,750.00 |
5 × ₹11.96
₹59.80
excl. GST
₹70.56 incl. 18% GST
- Dispatch in 15-18 working days
- GST invoice with every order
- Standard pack: 10,000 per reel
DF2B5SL,L3F
₹59.80 for 5 + GST
Specifications
- Clamping Voltage
- 14V
- Peak Pulse Current (Ipp)
- 5.5A@8/20us
- Peak Pulse Power Dissipation (Ppp)
- 77W@8/20us
- Number of Channels
- 1
- Voltage - Breakdown
- 4.5V
- type
- ESD
- Reverse Leakage Current (Ir)
- 100nA
- Reverse Stand-Off Voltage (Vrwm)
- 3.3V
Packaging & compliance
- RoHS
- ROHS3 Compliant
- Lifecycle
- Active
- ECCN
- EAR99
- Packaging
- Tape & Reel (TR)
- Standard pack
- 10,000 / Reel
- Sold per
- Piece
- Minimum order
- 5 (multiples of 5)
- Unit weight
- 0.001 g
Overview
The DF2B5SL is a TVS diode (ESD protection diode) protects semiconductor devices used in mobile device interfaces and other applications to protect against static electricity and noise. Utilizing snapback characteristics, the DF2B5SL provides low dynamic resistance and superior protective performance. Furthermore, the DF2B5SL is housed in an ultra-compact package (0.62mm×0.32mm) to meet applications that require a small footprint.
Applications
- Mobile Equipment
- Smartphones
- Tablets
- Notebook PCs
- Desktop PCs
Key features
- Suitable for use with a 3.3 V signal line. (VRWM ≤ 3.3 V)
- Protects devices with its high ESD performance. (VESD = ±17 kV (Contact / Air) @IEC61000 - 4 - 2)
- Low dynamic resistance protects semiconductor devices from static electricity and noise. (RDYN = 0.25 Ω (typ.))
- Snapback characteristics realizing low clamping voltage protects semiconductor devices. (VC = 9.5 V @IPP = 5.5 A (typ.))
- Compact package is suitable for use in high density board layouts such as in mobile devices. (0.62mm×0.32mm) size (Nickname: SL2)
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