Varnitronics
DF2B7AE,L3F TOSHIBA
TOSHIBA

DF2B7AE,L3F

11VC Clamp 4A@8/20us Ipp TVS DIODE SC-79(SOD-523)

SC-79(SOD-523)ROHS3 CompliantActive
Manufacturer
TOSHIBA
Manufacturer part #
DF2B7AE,L3F
Store part #
C1977478
Package / case
SC-79(SOD-523)
Category
TVS Diodes
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

490 in stock

#C1977478

Stock & price checked 3 days ago

QuantityUnit pricePack price
5+₹19.81₹99.05
50+₹19.46₹973.00
150+₹19.25₹2,887.50
500+₹19.02₹9,510.00

5 × ₹19.81

₹99.05

excl. GST

₹116.88 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 8,000 per reel

DF2B7AE,L3F

₹99.05 for 5 + GST

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Specifications

Clamping Voltage
11V
Peak Pulse Current (Ipp)
4A@8/20us
Peak Pulse Power Dissipation (Ppp)
80W@8/20us
Voltage - Breakdown
6.8V
type
TVS
Reverse Leakage Current (Ir)
100nA
Reverse Stand-Off Voltage (Vrwm)
5.5V

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
8,000 / Reel
Sold per
Piece
Minimum order
5 (multiples of 5)
Unit weight
0.011 g

Overview

The DF2B7AE is a TVS diode (ESD protection diode) protects semiconductor devices used in mobile device interfaces and other applications to protect against static electricity and noise. Utilizing snapback characteristics, the DF2B7AE provides low dynamic resistance and superior protective performance. Furthermore, the DF2B7AE is housed in an ultra-compact package (0.8 mm×1.2 mm) to meet applications that require a small footprint.

Applications

  • Mobile Equipment
  • Smartphones
  • Tablets
  • Notebook PCs
  • Desktop PCs

Key features

  • Suitable for use with a 5 V signal line. (VRWM≤5.5 V)
  • Protects devices with its high ESD performance. (VESD = ±30 kV (Contact / Air) @IEC61000 - 4 - 2)
  • Low dynamic resistance protects semiconductor devices from static electricity and noise. (RDYN = 0.2Ω (typ.))
  • Snapback characteristics realizing low clamping voltage protects semiconductor devices. (VC = 11 V @Ipp = 4 A (typ.))
  • Compact package is suitable for use in high density board layouts such as in mobile devices. (0.8 mm×1.2 mm) size (Toshiba package name: ESC)

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