MDD(Microdiode Semiconductor)
2N7002KN-Channel 60V 300mA 300mW Surface Mount SOT-23
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onsemiDatasheet (PDF)
FDMT800100DC
N-Channel 100V 162A 156W Surface Mount DualCool-88-8
DualCool-88-8ROHS3 CompliantActive
MOSFET N-CH 100V 162A DualCool-88-8
- Manufacturer
- onsemi
- Manufacturer part #
- FDMT800100DC
- Store part #
- C891112
- Package / case
- DualCool-88-8
- Category
- Single FETs, MOSFETs
- Packaging
- Tape & Reel (TR)
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement · policy
24 in stock
#C891112
Stock & price checked 5 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹1,044.40 | ₹1,044.40 |
| 10+ | ₹894.73 | ₹8,947.30 |
| 30+ | ₹803.54 | ₹24,106.20 |
| 100+ | ₹726.96 | ₹72,696.00 |
1 × ₹1,044.40
₹1,044.40
excl. GST
₹1,232.39 incl. 18% GST
- Dispatch in 15-18 working days
- GST invoice with every order
- Standard pack: 3,000 per reel
FDMT800100DC
₹1,044.40 for 1 + GST
Specifications
- Output Capacitance(Coss)
- 1.16nF
- Ciss-Input Capacitance
- 7.835nF
- Pd - Power Dissipation
- 156W
- Operating Temperature
- -55℃~+150℃
- Drain to Source Voltage
- 100V
- Current - Continuous Drain(Id)
- 162A
- Reverse Transfer Capacitance (Crss)
- 75pF
- RDS(on)
- 2.95mΩ@10V
- Number
- 1 N-channel
- Gate Charge(Qg)
- 79nC
- Vgs
- ±20V
- Gate Threshold Voltage (Vgs(th))
- 2.8V
- Type
- N-Channel
Packaging & compliance
- RoHS
- ROHS3 Compliant
- Lifecycle
- Active
- ECCN
- EAR99
- Packaging
- Tape & Reel (TR)
- Standard pack
- 3,000 / Reel
- Sold per
- Piece
- Minimum order
- 1
- Unit weight
- 0.63 g
Overview
Max ΓDS(on)=2.95 mΩ at VGS = 10 Vs , ΓD = 24 A Max ΓDS(on)=4.46 mΩ at VGS = 6 V , lD = 19 A Advanced Package and Silicon combination for low rDS(on) and high efficiency This N-Channel MOSFET is produced using advanced PowerTrench® process. Advancements in both silicon and Dual CoolTM package technologies have been combined to offer the lowest rDS(on) while maintaining excellent switching performance by extremely low Junction-to-Ambient thermal resistance. Low profile 8x8mm MLP package
Applications
- OringFET / Load Switching
- Synchronous Rectification
- DC-DC Conversion
Key features
- Advanced Package and Silicon combination for low rDS(on) and high efficiency
- Advancements in both silicon and Dual CoolTM package technologies have been combined to offer the lowest rDS(on) while maintaining excellent switching performance by extremely low Junction-to-Ambient thermal resistance
- Low profile 8x8mm MLP package
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