Varnitronics
FR8008HP FREQCHIP
FREQCHIP

FR8008HP

ARM Cortex-M3 32 Bit 96MHz QFN-40(5x5) Microcontrollers

QFN-40(5x5)RoHSActive

Low-power Bluetooth SoC chip supporting SIG MESH

Manufacturer
FREQCHIP
Manufacturer part #
FR8008HP
Store part #
C7293546
Package / case
QFN-40(5x5)
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

3,645 in stock

#C7293546

Stock & price checked 6 days ago

QuantityUnit pricePack price
1+₹224.05₹224.05
10+₹205.12₹2,051.20
30+₹193.30₹5,799.00
100+₹181.04₹18,104.00
500+₹175.67₹87,835.00
1,000+₹173.30₹1,73,300.00

1 × ₹224.05

₹224.05

excl. GST

₹264.38 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 7–10 working days
  • GST invoice with every order
  • Standard pack: 5,000 per reel

FR8008HP

₹224.05 for 1 + GST

Specifications

ADC (Bit)
10bit
Number of I/O
34
Operating Temperature
-20℃~+85℃
Voltage - Supply
2V~4.3V
Program Memory Type
FLASH
Program Storage Size
16MB
CPU Core
ARM Cortex-M3
Core Size
32 Bit
CPU Maximum Speed
96MHz
Oscillator Type
Built-in+External

Packaging & compliance

RoHS
RoHS
Lifecycle
Active
Packaging
Tape & Reel (TR)
Standard pack
5,000 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.16 g

Overview

The FR800x series chips are low-power Bluetooth chips designed for SOC (System-on-Chip) applications, enabling rapid development. Built on Bluetooth Smart firmware and protocol stack support, they are fully compatible with the Bluetooth V5.1 (LE mode) specification. Users can also develop a wide range of applications based on the built-in ARM Cortex-M3 embedded 32-bit high-performance MCU. The Bluetooth Smart firmware includes L2CAP service layer protocol, Security Manager (SM), Attribute Protocol (ATT), Generic Attribute Profile (GATT), and Generic Access Profile (GAP). Additionally, it supports application profiles such as Proximity, Health Thermometer, Heart Rate, Blood Pressure, Blood Glucose, Human Interface Device (HID), and SDK (including drivers, OS-API, etc.). The SDK also integrates the SIG Mesh protocol for network applications. Leveraging innovative technology, the PMU (Li-battery charger + LDO), QSPI FLASH ROM with XIP mode, I2C, UART, GPIO, ADC, and PWM are all integrated into a single chip, delivering competitive power consumption, stable Bluetooth connectivity, and an ultra-low BOM cost to customers.

Applications

  • Smart keyboard & mouse
  • Smart wearables
  • Smart lock
  • Smart home
  • IoT
  • SIG Mesh applications

Key features

  • Built-in 32-bit ARM Cortex-M3 core, supporting up to 96MHz clock frequency
  • 512KB/1MB/4MB/8MB/16MB Flash
  • 56KB SRAM
  • 4KB Cache
  • 128KB ROM
  • BOOT startup code
  • Controller protocol stack
  • Bluetooth V5.1 LE standard
  • Supports 2M/1M/500K/125K data rates
  • Built-in charge management unit
  • Integrated DC-DC, LDO
  • General-purpose GPIO
  • Timer ×2
  • eFuse 128-bit
  • SPIM ×2
  • SPIS
  • UART (FIFO depth 16/32)
  • QSPI ×2
  • I2C (FIFO depth 8/32)
  • PWM ×8
  • PDM
  • USB OTG
  • 8080 parallel interface
  • 8-channel 10-bit SAR ADC
  • Maximum sampling data rate 1Mbps
  • FIFO mode
  • Sampling trigger follows PWM pulse
  • Operating temperature range: -40℃~+105℃

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