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GD32F130R8T6 GigaDevice Semicon Beijing
GigaDevice Semicon Beijing

GD32F130R8T6

ARM Cortex-M3 32 Bit 72MHz LQFP-64(10x10) Microcontrollers

LQFP-64(10x10)RoHSActive

ARM Cortex-M3 32-bit MCU

Manufacturer part #
GD32F130R8T6
Store part #
C81553
Package / case
LQFP-64(10x10)
Packaging
Tray
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

1,120 in stock

#C81553

Stock & price checked 6 days ago

QuantityUnit pricePack price
1+₹237.93₹237.93
10+₹174.86₹1,748.60

1 × ₹237.93

₹237.93

excl. GST

₹280.76 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 7–10 working days
  • GST invoice with every order
  • Standard pack: 160 per tray

GD32F130R8T6

₹237.93 for 1 + GST

Specifications

ADC (Bit)
12bit
Number of I/O
55
Voltage - Supply
2.6V~3.6V
Program Memory Type
FLASH
Program Storage Size
64KB
CPU Core
ARM Cortex-M3
Core Size
32 Bit
CPU Maximum Speed
72MHz
Oscillator Type
Built-in+External

Packaging & compliance

RoHS
RoHS
Lifecycle
Active
ECCN
EAR99
Packaging
Tray
Standard pack
160 / Tray
Sold per
Piece
Minimum order
1
Unit weight
1.557 g

Overview

The GD32F130xx device belongs to the value line of GD32 MCU family. It is a 32-bit general-purpose microcontroller based on the high performance ARM Cortex-M3 RISC core with best ratio in terms of processing power, reduced power consumption and peripheral set. The Cortex-M3 is a next generation processor core which is tightly coupled with a Nested Vectored Interrupt Controller (NVIC), SysTick timer and advanced debug support. The GD32F130xx device incorporates the ARM Cortex-M3 32-bit processor core operating at 72 MHz frequency with Flash accesses zero wait states to obtain maximum efficiency. It provides up to 64 KB on-chip Flash memory and up to 8 KB SRAM memory. An extensive range of enhanced I/Os and peripherals connected to two APB buses. The devices offer one 12-bit ADC, up to five general 16-bit timers, a general 32-bit timer, a PWM advanced timer, as well as standard and advanced communication interfaces: up to two SPIs, two I2Cs and two USARTs. The device operates from a 2.6 to 3.6 V power supply and available in -40 to +85 ℃ temperature range. Several power saving modes provide the flexibility for maximum optimization between wakeup latency and power consumption, an especially important consideration in low power applications.

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