HK32F103RCT6

The HK32F103xCxDxE series is based on the ARM Cortex-M3 core, operating at up to 120 MHz. It integrates large-capacity on-chip memory: up to 512 Kbyte Flash and 64 Kbyte SRAM. In addition, up to 1 Gbyte of NOR/PSRAM/NAND/PC Card memory can be connected externally via the FSMC module, of which 256 Mbyte is addressable for instruction storage and can be cached by the on-chip 1 Kbyte instruction cache. The built-in CRC module provides data integrity checking. A rich set of communication interfaces is integrated to support diverse communication scenarios: 5x USART/UART, 3x SPI (SPI2/3 support I2S protocol), 1x SDIO, 2x I2C, 1x CAN 2.0 A/B, and 1x FS USB. The device includes 2 advanced 16-bit PWM timers (8 PWM output channels total, 6 of which feature dead-time complementary output), 4 general-purpose 16-bit PWM timers (16 PWM output channels total), and 2 basic 16-bit timers. A dedicated VBAT battery power domain is provided, allowing the RTC module to continue operating from VBAT when the main VDD supply is lost; additionally, the VBAT domain includes 84 bytes of backup registers. Rich analog peripherals are integrated: 3x 12-bit ADCs (supporting up to 16 external analog input channels simultaneously, including 2 weak-drive signal input channels and 1 high-voltage 5V signal input channel), 2x 12-bit DACs, 1 temperature sensor, 1 internal 0.8V reference voltage source, 1 programmable voltage detector (PVD), 1 power-on/power-down reset (POR/PDR) circuit, and 1 VBAT power resistor voltage divider (divider output internally connected to the ADC). A wide range of low-power modes is supported; in the lowest power mode, the typical leakage current is less than 100 nA. Operating over a temperature range of -40℃ to +105℃ with a supply voltage of 2.0V to 3.6V, the device meets the requirements of most application environments. The complete HK32F103xC, HK32F103xD, and HK32F103xE series are available in two package options ranging from 64-pin to 100-pin. Peripheral configurations may vary depending on the package type.

Applications

• Industrial applications: programmable controllers, printers, scanners, etc.
• HMI audio/video multimedia interactive graphic display devices: advertising displays, voice recognition devices, security monitoring devices, motor drive and speed control
• IoT low-power sensor terminals: fitness bands, etc.
• UAV flight control, gimbal control
• Toy products
• Home appliances
• Intelligent robots
• Smartwatches

Key features

• ARM Cortex-M3 core maximum clock frequency: 120 MHz
• 24-bit System Tick timer supports CPU Event signal input to MCU pin for synchronization with other SoC CPUs on the board
• Dual power domain operating voltage range: main supply VDD 2.0 - 3.6V, backup supply VBAT 1.8 - 3.6V; RTC continues to operate from VBAT when main power is lost; VBAT domain provides 84 bytes of backup registers
• Operating temperature range: -40℃ to +105℃
• VDD typical operating current:
• Run mode: 19.3 mA@120 MHz@3.3V
• Sleep mode: 5.6 mA@120 MHz@3.3V (wake-up time: 1 machine clock cycle)
• Stop mode LDO low-power mode: 89.4 μA@3.3V (wake-up time: 10 μs)
• LDO full-speed mode: 303 μA@3.3V
• Standby mode: 3.3 μA@3.3V (wake-up time: 150 μs)
• VBAT typical operating current (VDD powered off):
• VBAT RTC-on mode: 2.6 μA@3.3V
• VBAT RTC-off mode: 2.1 μA@3.3V
• Memory:
• Up to 512 Kbytes Flash; 0-wait-state bus cycle when CPU frequency ≤ 24 MHz; code security protection with independently configurable read and write protection
• 64 Kbytes on-chip SRAM
• FSMC interface supports up to 1 Gbyte external NOR/PSRAM/NAND/PC Card memory (256 Mbytes of which can store instructions for on-chip cache use)
• Data security: CRC32 hardware unit
• Clocks:
• External high-speed clock (HSE): 4 - 32 MHz, typical 8 MHz
• External low-speed clock (LSE): 32.768 kHz
• Internal high-speed clock (HSI): configurable at 8 MHz / 28 MHz / 56 MHz
• Internal low-speed clock (LSI): 40 kHz
• PLL output clock: 120 MHz (maximum)
• GPIO external input clock: 1 - 64 MHz
• Reset sources:
• External pin reset
• Power-on/power-down reset (POR/PDR)
• Software reset
• Watchdog reset (IWDG and WWDG)
• Low-power management reset
• Programmable Voltage Detector (PVD):
• 8 selectable voltage threshold levels
• Configurable rising-edge and falling-edge detection
• General-purpose I/O (GPIO):
• 51 GPIO pins in 64-pin package; 80 GPIO pins in 100-pin package
• All GPIO pins configurable as external interrupt inputs
• Built-in switchable pull-up and pull-down resistors
• Open-drain output support
• Schmitt trigger hysteresis input support
• Four output drive strength levels: ultra-high, high, medium, and low
• Communication interfaces:
• 5× USART/UART (USART1/2/3, UART4/5)
• 3× SPI (SPI2/3 support I2S protocol)
• 2× I2C
• 1× SDIO
• 1× CAN 2.0A/2.0B
• 1× full-speed USB 2.0
• Timers and PWM generators:
• Advanced timers: TIM1/TIM8 (complementary PWM output with dead-time insertion)
• General-purpose timers: TIM2/TIM3/TIM4/TIM5
• Basic timers: TIM6/TIM7 (support CPU interrupt, DMA request, and DAC conversion trigger)