MDD(Microdiode Semiconductor)
2N7002KN-Channel 60V 300mA 300mW Surface Mount SOT-23
From
₹2.32
25,99,250 in stock

60V 454A TOLT
MOSFET 60V 454A TOLT
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100% Authentic · 30-Day Return or Replacement · policy
19 in stock
#C20191622
Stock & price checked 3 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹786.70 | ₹786.70 |
| 10+ | ₹671.79 | ₹6,717.90 |
| 30+ | ₹601.86 | ₹18,055.80 |
| 100+ | ₹543.00 | ₹54,300.00 |
1 × ₹786.70
₹786.70
excl. GST
₹928.31 incl. 18% GST
IPTC007N06NM5ATMA1
₹786.70 for 1 + GST
- The TO-Leadless package offers the industry's lowest on-resistance RDS(ON) and high current-carrying capability. This reduces the number of parallel MOSFETs required in high-power applications and increases power density. Additionally, it saves 60% board space compared to the D2PAK 7-pin package. - Compared to the D2PAK 7-pin package, the TO-Leadless package provides 50% larger soldering contact area, reducing current density and preventing electromigration under high current and high temperature conditions, thereby improving reliability. TO-Leadless is a leadless package that enables optical inspection via its tin-plated trench gate and source contacts. - The TOLG package combines the best features of the TO-Leadless and D2PAK 7-pin packages. It shares the same package footprint and excellent electrical performance as the TOLL package. The advantage of the TOLG package lies in the flexibility offered by its gull-wing leads, which provide superior soldering reliability on Aluminum-IMS. Thanks to this feature, the TOLG package delivers twice the board-level thermal cycling (TCoB) performance required by IPC-9701. - Like the TOLL package, the TOLT package offers high current capacity and a slim profile, with the added benefit of top-side cooling for optimal thermal performance. Bottom-cooled packages such as TOLL or D2PAK dissipate heat through the PCB to the heatsink, resulting in higher power losses. The TOLT package uses top-side cooling with the drain exposed on the package surface, enabling direct heat dissipation to the heatsink — improving RthJA by 20% and RthJC by 50% compared to the TOLL package. To achieve the same current-carrying capability as bottom-cooled packages, the TOLT package enables significant reduction in heatsink size, lowering overall system cost.
Same category
MDD(Microdiode Semiconductor)
2N7002KN-Channel 60V 300mA 300mW Surface Mount SOT-23
From
₹2.32
25,99,250 in stock