MDD(Microdiode Semiconductor)
2N7002KN-Channel 60V 300mA 300mW Surface Mount SOT-23
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₹2.32
25,99,250 in stock
VISHAYDatasheet (PDF)
SI7633DP-T1-GE3
P-Channel 20V 60A 104W Surface Mount PowerPAKSO-8
PowerPAKSO-8ROHS3 CompliantActive
MOSFET P-CH 20V 60A PowerPAKSO-8
- Manufacturer
- VISHAY
- Manufacturer part #
- SI7633DP-T1-GE3
- Store part #
- C3289470
- Package / case
- PowerPAKSO-8
- Category
- Single FETs, MOSFETs
- Packaging
- Tape & Reel (TR)
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement · policy
47 in stock
#C3289470
Stock & price checked 5 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹180.36 | ₹180.36 |
| 10+ | ₹176.01 | ₹1,760.10 |
| 30+ | ₹173.19 | ₹5,195.70 |
| 100+ | ₹170.59 | ₹17,059.00 |
1 × ₹180.36
₹180.36
excl. GST
₹212.82 incl. 18% GST
- Dispatch in 15-18 working days
- GST invoice with every order
- Standard pack: 3,000 per reel
SI7633DP-T1-GE3
₹180.36 for 1 + GST
Specifications
- Operating Temperature
- -55℃~+150℃
- Drain to Source Voltage
- 20V
- Output Capacitance(Coss)
- 1.83nF
- Current - Continuous Drain(Id)
- 60A
- Ciss-Input Capacitance
- 9.5nF
- Pd - Power Dissipation
- 104W
- Reverse Transfer Capacitance (Crss)
- 1.74nF
- RDS(on)
- 5.5mΩ@4.5V
- Number
- 1 P-Channel
- Gate Charge(Qg)
- 260nC@10V
- Gate Threshold Voltage (Vgs(th))
- 3V
- Type
- P-Channel
Packaging & compliance
- RoHS
- ROHS3 Compliant
- Lifecycle
- Active
- ECCN
- EAR99
- Packaging
- Tape & Reel (TR)
- Standard pack
- 3,000 / Reel
- Sold per
- Piece
- Minimum order
- 1
- Unit weight
- 0.278 g
Overview
P-Channel MOSFET for switching applications are now available with die on resistances around 1 mΩ and with the capability to handle 85 A. PowerPAK is a new package technology. The PowerPAK SO - 8 utilizes the same footprint and the same pin - outs as the standard SO - 8. This allows PowerPAK to be substituted directly for a standard SO - 8 package. Being a leadless package, PowerPAK SO - 8 utilizes the entire SO - 8 footprint, freeing space normally occupied by the leads, and thus allowing it to hold a larger die than a standard SO - 8. The bottom of the die attach pad is exposed for the purpose of providing a direct, low resistance thermal path to the substrate the device is mounted on. The package height is lower than the standard SO - 8, making it an excellent choice for applications with space constraints.
Applications
- Adapter switch
Key features
- TrenchFET power MOSFET
- 100 % UIS tested
Alternatives
Similar parts — check the datasheet before substituting.
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