SiR404DP-T1-GE3

N-Channel 20 V (D-S) MOSFET in PowerPAK SO-8 single package. PowerPAK is a new packaging technology developed based on the SO-8 package. The PowerPAK SO-8 shares the same footprint and pin configuration as the standard SO-8, making it a drop-in replacement. As a leadless package, it utilizes the entire SO-8 footprint to accommodate a larger die than the standard SO-8. The die attach pad on the bottom of the die is exposed to provide a direct low-resistance thermal path, and the package height is lower than that of the standard SO-8, making it suitable for space-constrained applications. The PowerPAK single package is easy to use — its pin layout and dimensions are identical to those of standard SO-8 devices. The land pads are a direct match to SO-8, with only the drain connection area extended, allowing installation onto existing SO-8 pad patterns.

Applications

• Fixed Telecom - OR-ing - Point of Load (POL)

Key features

• 3rd Generation Trench Field Effect Transistor (TrenchFET Gen III) Power MOSFET
• 100% Rg and UIS tested
• 2.5 V and 3.3 V gate drive MOSFET for DC/DC applications
• RoHS compliant
• Halogen-free