SQJ128ELP-T1_GE3

Automotive-grade N-channel 40 V (D-S), 175 °C MOSFET in PowerPAK 1212-8 single-transistor package. PowerPAK is a new packaging technology that addresses these challenges. The PowerPAK 1212-8 achieves ultra-low thermal resistance in a compact footprint, making it ideal for space-constrained applications. The PowerPAK 1212-8 package is derived from the PowerPAK SO-8, sharing the same packaging technology to maximize die area. The exposed die attach pad on the bottom provides a direct, low-resistance thermal path to the substrate on which the device is mounted. As a result, the PowerPAK 1212-8 brings the advantages of the PowerPAK SO-8 into a smaller package while delivering the same level of thermal performance. Its footprint is comparable to that of a TSOP-6 and more than 40% smaller than a standard TSSOP-8. It offers more than twice the die capacity of a standard TSOP-6. Thermal performance is an order of magnitude better than SO-8 and 20x better than TSSOP-8. Its thermal performance surpasses all existing SMT packages on the market. It fully utilizes the heat dissipation capability of any PCB. Compared to TSSOP-8, the reduced junction temperature also improves die efficiency by approximately 20%. For applications that typically require a larger package solely for thermal reasons, the PowerPAK 1212-8 is an excellent choice.

Key features

• TrenchFET Gen IV Power MOSFET
• AEC-Q101 Qualified
• 100% Tested for Rg and UIS
• Qgd/Qgs Ratio <1 for Optimized Switching Performance