TPSMA6L33A

The TPSMA6L series is designed specifically to protect sensitive electronic equipment from voltage transients induced by load dump and other transient voltage events, and it’s especially suitable for high reliability and automotive application. SMA low profile package (DO221-AC) has the same electronical performance as the SMB package but with low height profiles (1.1 mm).

Applications

• Protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications

Key features

• Same power as standard SMB devices (600 W)
• Hi reliability application and automotive grade AEC Q101 qualified
• SMA low profile package: less than 1.1 mm
• Footprint compatibility with standard SMA and SMB products (easy to layout)
• Typical failure mode is short from over-specified voltage or current
• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
• IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)
• ESD protection of data lines in accordance with IEC 61000-4-2
• EFT protection of data lines in accordance with IEC 61000-4-4
• Low inductance, excellent clamping capability
• Fast response time: typically less than 1.0ns from 0 Volts to VBR min
• Built-in strain relief
• Glass passivated junction
• High temperature soldering: 260°C/10 seconds at terminals
• Plastic package has underwriters laboratory flammability V-0
• Typical maximum temperature coefficient ΔVBR = 0.1%×VBR@25°C×ΔT
• Matte tin lead–free plated
• Halogen free and RoHS compliant
• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01)