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AM3352BZCZA60 TI
TI

AM3352BZCZA60

ARM Cortex-ASeries 600MHz SPBGA-N324 Microprocessors RoHS

SPBGA-N324ROHS3 CompliantActive

Sitara processor: Arm Cortex-A8, 1Gb Ethernet, supports display functionality, CAN

Manufacturer
TI
Manufacturer part #
AM3352BZCZA60
Store part #
C115044
Package / case
SPBGA-N324
Packaging
Tray
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

5,168 in stock

#C115044

Stock & price checked 6 days ago

QuantityUnit pricePack price
1+₹1,093.21₹1,093.21
10+₹930.35₹9,303.50
30+₹831.17₹24,935.10
126+₹747.93₹94,239.18

1 × ₹1,093.21

₹1,093.21

excl. GST

₹1,289.99 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 7–10 working days
  • GST invoice with every order
  • Standard pack: 126 per tray

AM3352BZCZA60

₹1,093.21 for 1 + GST

Specifications

CPU Core
ARM Cortex-ASeries
CPU Maximum Speed
600MHz

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
5A992C
Packaging
Tray
Standard pack
126 / Tray
Sold per
Piece
Minimum order
1
Unit weight
1.637 g

Overview

Key features

  • Up to 1GHz Sitara ARM Cortex-A8 32-bit RISC processor
  • NEON SIMD coprocessor
  • 32KB L1 instruction cache and 32KB data cache with parity
  • 256KB L2 cache with ECC
  • 176KB on-chip boot ROM
  • 64KB dedicated RAM
  • Emulation and debug — JTAG
  • Interrupt controller (up to 128 interrupt requests)
  • On-chip memory (shared L3 RAM)
  • 64KB general-purpose OCMC RAM
  • Accessible by all masters — supports retention for fast wakeup
  • External Memory Interface (EMIF)
  • mDDR (LPDDR), DDR2, DDR3, DDR3L controller:
  • mDDR: 200MHz clock (400MHz data rate)
  • DDR2: 266MHz clock (532MHz data rate)
  • DDR3: 400MHz clock (800MHz data rate)
  • DDR3L: 400MHz clock (800MHz data rate)
  • 16-bit data bus
  • 1GB total addressable space
  • Supports one x16 or two x8 memory device configurations
  • General-Purpose Memory Controller (GPMC)
  • Flexible 8-bit and 16-bit asynchronous memory interface with up to seven chip selects (NAND, NOR, multiplexed NOR, and SRAM)
  • BCH code support with 4-bit, 8-bit, or 16-bit ECC
  • Hamming code support for 1-bit ECC
  • Error Location Module (ELM)
  • When used with GPMC, determines error addresses in generated syndrome polynomials via BCH algorithm
  • Supports 4-bit, 8-bit, and 16-bit per 512-byte block error location based on BCH algorithm
  • Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
  • Supports EtherCAT, PROFIBUS, PROFINET, EtherNet/IP, and other protocols
  • Two Programmable Real-Time Units (PRUs)
  • 32-bit load/store RISC processor running at 200MHz
  • 8KB instruction RAM with parity
  • 8KB data RAM with parity
  • Single-cycle 32-bit multiplier with 64-bit accumulator
  • Enhanced GPIO module with shift-in/shift-out support and parallel latch for external signals
  • 12KB shared RAM with parity
  • Three 120-byte register banks accessible by each PRU
  • Interrupt Controller (INTC) for handling system input events
  • Local interconnect bus connecting internal and external masters to PRU-ICSS internal resources
  • Peripherals within PRU-ICSS:
  • One UART port with flow control pins, supporting data rates up to 12Mbps
  • One enhanced capture (eCAP) module
  • Two MII Ethernet ports supporting industrial Ethernet (e.g., EtherCAT)
  • One MDIO port
  • Power, Reset, and Clock Management (PRCM) module
  • Controls entry and exit of standby and deep sleep modes
  • Manages sleep sequencing, power domain shutdown sequencing, wakeup sequencing, and power domain power-on sequencing
  • Clocks
  • Integrated high-frequency oscillator (15MHz to 35MHz) for generating reference clocks for various system and peripheral clocks
  • Individual clock enable/disable control per subsystem and peripheral for reduced power consumption
  • Five ADPLLs for generating system clocks (MPU subsystem, DDR interface, USB, peripherals [MMC and SD, UART, SPI, I²C], L3, L4, Ethernet, GFX [SGX530], and LCD pixel clock)
  • Power
  • Two non-switchable power domains (RTC and WAKEUP logic)
  • Three switchable power domains (MPU subsystem [MPU], SGX530 [CFX], peripherals and infrastructure [PER])
  • SmartReflex Class 2B implementation for core voltage regulation based on die temperature, process variation, and performance (Adaptive Voltage Scaling [AVS])
  • Dynamic Voltage and Frequency Scaling (DVFS)
  • Real-Time Clock (RTC)
  • Real-time date (year, month, day, and day of week) and time (hours, minutes, and seconds)
  • Internal 32.768kHz oscillator, RTC logic, and 1.1V internal LDO
  • Dedicated power-on reset (RTC_PWRONRSTn) input
  • Dedicated input pin for external wakeup events (EXT_WAKEUP)
  • Programmable alarm for generating PRCM internal interrupts (for wakeup) or Cortex-A8 internal interrupts (for event notification)
  • Programmable alarm with external output (PMIC_POWER_EN) for enabling the PMIC to restore non-RTC power domains
  • Peripherals
  • Up to two USB 2.0 high-speed OTG ports with integrated PHY
  • Up to two industrial Gigabit Ethernet MACs (10, 100, and 1000Mbps)
  • Integrated switch
  • Each MAC supports MII, RMII, RGMII, and MDIO interfaces
  • Ethernet MAC and switch capable of running IEEE 1588v2 Precision Time Protocol (PTP) independently of other functions
  • Up to two CAN ports
  • Supports CAN version 2 parts A and B
  • Up to two McASP ports
  • Transmit and receive clocks up to 50MHz
  • Up to four serial data pins per McASP port with independent TX and RX clocks
  • Supports TDM, I2S, and similar formats
  • Supports digital audio interface transmission (SPDIF, IEC60958-1, and AES-3 formats)

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