Varnitronics
AXP313A X-Powers Tech
X-Powers Tech

AXP313A

QFN-20 Power Management - Specialized

QFN-20RoHSActive

AXP313A PMlC For Multi-Core High-Performance System

Manufacturer
X-Powers Tech
Manufacturer part #
AXP313A
Store part #
C5365290
Package / case
QFN-20
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

2,835 in stock

#C5365290

Stock & price checked 6 days ago

QuantityUnit pricePack price
1+₹115.03₹115.03
10+₹92.46₹924.60
30+₹81.39₹2,441.70
100+₹70.11₹7,011.00
500+₹63.37₹31,685.00
1,000+₹59.91₹59,910.00

1 × ₹115.03

₹115.03

excl. GST

₹135.74 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 7–10 working days
  • GST invoice with every order
  • Standard pack: 3,000 per reel

AXP313A

₹115.03 for 1 + GST

Specifications

Features
Dynamic voltage scaling;Output discharge;Power-on timing control;Overcurrent Protection;Operating status indication;EMI optimization (spread spectrum);Light load efficient mode
Operating Temperature
-40℃~+85℃
Voltage - Supply
3V~5.5V
Output Voltage
0.5V~3.4V;0.5V~1.54V;0.5V~1.84V;0.5V~3.5V;1.8V;2.5V;2.8V;3.3V

Packaging & compliance

RoHS
RoHS
Lifecycle
Active
Packaging
Tape & Reel (TR)
Standard pack
3,000 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.062 g

Overview

AXP313A is a highly integrated power management IC designed for applications requiring multiple power conversion outputs. It can work alongside other BMUs to form a power solution for battery-based applications, or be used in low-power, battery-free designs such as IPCs and smart speakers, fully meeting the requirements of application processor systems for relatively complex and precise power control. AXP313A supports 6 power outputs (including 3 DCDC and 3 LDO channels). To ensure safe and stable operation of the power system, AXP313A integrates protection circuits for OVP, UVP, OCP, and OTP. In addition, AXP313A features power management functions such as power on/off and sleep/wake-up, reflecting the value of integrated chip management. AXP313A supports TWSI, enabling the system to dynamically adjust output voltage, control power output and shutdown, and flexibly configure interrupt management and sleep/wake-up conditions. AXP313A is available in a 3mm x 3mm 20-pin QFN package.

Applications

  • OTT box
  • IPC

Key features

  • 3 DCDCs
  • DCDC1: 0.5~1.2V, 10mV/step, 1.22~1.54V, 20mV/step, 1.6~3.4V, 0.1V/step, IMAX=1.5A
  • DCDC2: 0.5~1.2V, 10mV/step, 1.22~1.54V, 20mV/step, IMAX=3A@VIN=5V, IMAX=2.5A@VIN=3.7V
  • DCDC3: 0.5~1.2V, 10mV/step, 1.22~1.84V, 20mV/step, IMAX=2A
  • 3 LDOs
  • RTCLDO: 1.8V/2.5V/2.8V/3.3V, IMAX=30mA
  • ALDO1: 0.5~3.5V, 0.1V/step, IMAX=300mA
  • DLDO1: 0.5~3.5V, 0.1V/step, IMAX=500mA
  • TWSI communication support, slave address configurable as 0x36 or 0x37 (7 bits)
  • Internal temperature sensor with over-temperature protection
  • DCDC output voltage monitoring with interrupt, under/over-voltage protection
  • Customizable DCDC/LDO power-on sequencing and default output voltages

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