SAMSUNG

KLM8G1GETF-B041

8GB eMMC 5.1 FBGA-153(11.5x13) Memory RoHS

FBGA-153(11.5x13)ROHS CompliantActive

eMMC 5.1 Specification compatibility

Manufacturer: SAMSUNG
Manufacturer part #: KLM8G1GETF-B041
Store part #: C499918
Package / case: FBGA-153(11.5x13)
Category: Memory
Packaging: Tray

Datasheet (PDF)

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1,020 in stock

#C499918

Stock & price checked 5 days ago

Quantity	Unit price	Pack price
1+	₹2,955.70	₹2,955.70
30+	₹2,805.69	₹84,170.70

Quantity (min 1)

1 × ₹2,955.70

₹2,955.70

excl. GST

₹3,487.73 incl. 18% GST

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GST invoice with every order
Standard pack: 112 per tray

KLM8G1GETF-B041

₹2,955.70 for 1 + GST

Specifications

Operating Temperature: -25℃~+85℃
Features: Built-in wear leveling function;Bad block management function;ECC error correction function;Hardware reset function;Secure write protection function
Memory Size: 8GB
Reading Speed in Sequence: 330MB/S
Writing Speed in Sequence: 50MB/S
NAND Operating Voltage (VCCF): 2.7V~3.6V
Interface: eMMC 5.1
Controller Operating Voltage (VCCQ): 1.7V~1.95V;2.7V~3.6V

Packaging & compliance

RoHS: ROHS Compliant
Lifecycle: Active
ECCN: 3A991b1a
Packaging: Tray
Standard pack: 112 / Tray
Sold per: Piece
Minimum order: 1
Unit weight: 0.18 g

Overview

SAMSUNG eMMC is an embedded MMC solution designed in a BGA package form. eMMC operation is identical to a MMC device and therefore is a simple read and write to memory using MMC protocol v5.1 which is a industry standard. eMMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG eMMC supports HS400 in order to improve sequential bandwidth, especially sequential read performance. There are several advantages of using eMMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host. Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market. The embedded flash management software or FTL(Flash Transition Layer) of eMMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Samsung NAND flash and achieves optimal performance.

Key features

embedded MultiMediaCard Ver. 5.1 compatible.
SAMSUNG eMMC supports features of eMMC5.1 which are defined in JEDEC Standard
Major Supported Features : HS400, Field Firmware Update, Cache, Command Queuing, Enhanced Strobe Mode, Secure Write Protection, Partition types.
Non-supported Features : Large Sector Size (4KB)
Backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-eMMC system)
Data bus width : 1bit (Default), 4bit and 8bit
MMC I/F Clock Frequency : 0 ~ 200MHz MMC I/F Boot Frequency : 0 ~ 52MHz
Temperature : Operation (-25℃~85℃), Storage without operation (-40℃~85℃)
Power : Interface power → VCCQ(1.70~1.95V), Memory power → VCC (2.7~3.6V)