SN74ALVTH16374DLR

The 'ALVTH16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. These devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK), the flip-flops store the logic levels set up at the data (D) inputs. A buffered output-enable (OE(overline)) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components. OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74ALVTH16374 is characterized for operation from -40℃ to 85℃.

Applications

• Buffer registers
• I/O ports
• Bidirectional bus drivers
• Working registers

Key features

• State-of-the-Art Advanced BiCMOS Technology (ABT) Widebus Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
• Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
• Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3V, TA = 25℃
• High Drive (-24/24 mA at 2.5-V VCC and –32/64 mA at 3.3-V)
• Power Off Disables Outputs, Permitting Live Insertion
• High-Impedance State During Power Up and Power Down Prevents Driver Conflict
• Uses Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
• Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
• Latch-Up Performance Exceeds ±50 mA Per JESD 17
• ESD Protection – Exceeds 2000 V Per MIL-STD-883, Method 3015 – Exceeds 200 V Using Machine Model Exceeds 1000 V Using Charged-Device Model, Robotic Method
• Flow-Through Architecture Facilitates Printed Circuit Board Layout
• Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
• Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package