SN74AUP2G32YFPR

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire V_CC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity. The SN74AUP2G32 performs the Boolean function Y = A + B or Y = AB(overline) in positive logic. NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using I_0ff. The I_0ff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Applications

• Battery-powered portable devices
• Point-to-point applications

Key features

• Available in the Texas Instruments NanoStar Package
• Low Static-Power Consumption (I_CC = 0.9 μA Maximum)
• Low Dynamic-Power Consumption (C_pd = 4.3 pF Typ at 3.3 V)
• Low Input Capacitance (C_i = 1.5 pF Typical)
• Low Noise – Overshoot and Undershoot < 10% of V_CC
• I_off Supports Partial-Power-Down Mode Operation
• Wide Operating V_CC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• t_pd = 4.3 ns Maximum at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
• 2000-V Human-Body Model (A114-B, Class II)
• 1000-V Charged-Device Model (C101)