Varnitronics
DS90LV019TMTCX/NOPB TI
TI

DS90LV019TMTCX/NOPB

Transceiver 100Mbps SSOP-14-4.4mm Drivers, Receivers, Transceivers RoHS

SSOP-14-4.4mmROHS3 CompliantActive

DS90LV019 3.3V or 5V LVDS Driver/Receiver

Manufacturer
TI
Manufacturer part #
DS90LV019TMTCX/NOPB
Store part #
C87061
Package / case
SSOP-14-4.4mm
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

1,275 in stock

#C87061

Stock & price checked 6 days ago

QuantityUnit pricePack price
1+₹383.76₹383.76
10+₹328.26₹3,282.60
30+₹293.57₹8,807.10
100+₹231.56₹23,156.00
500+₹215.52₹1,07,760.00
1,000+₹208.58₹2,08,580.00

1 × ₹383.76

₹383.76

excl. GST

₹452.84 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 7–10 working days
  • GST invoice with every order
  • Standard pack: 2,500 per reel

DS90LV019TMTCX/NOPB

₹383.76 for 1 + GST

Specifications

Voltage - Supply
3.3V;5V
Type
Transceiver
Data Rate
100Mbps
Operating Temperature
-40℃~+85℃
Number of Drivers
1
Features
Fail-safe;Hot-plug / power-up glitch-free
Level Standard
LVDS
Number of Receivers
1

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
2,500 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.089 g

Overview

The DS90LV019 is a Driver/Receiver designed specifically for the high speed low power point- to- point interconnect applications. The device operates from a single 3.3V or 5.0V power supply and includes one differential line driver and one receiver. The DS90LV019 features an independent driver and receiver with TTL/CMOS compatibility (DIN and ROUT). The logic interface provides maximum flexibility as 4 separate lines are provided (DIN,DE, RE, and ROUT). The device also features a flow- through pin out which allows easy PCB routing for short stubs between its pins and the connector. The driver has 3.5mA output loop current. The driver translates between TTL levels (single- ended) to Low Voltage Differential Signaling levels. This allows for high speed operation, while consuming minimal power with reduced EMI. In addition, the differential signaling provides common- mode noise rejection. The receiver threshold is ±100mV over a ±1V commonmode range and translates the low swing differential levels to standard (TTL/CMOS) levels.

Applications

  • High-speed, low-power point-to-point interconnect transmission applications
  • LVDS circuit design recommendation: Use at least a 4-layer PCB with dedicated layers for LVDS signals, ground, power, and TTL signals
  • LVDS circuit design recommendation: Place drivers and receivers as close as possible to the LVDS port-side connectors
  • LVDS circuit design recommendation: Each device requires bypass capacitors combined with distributed bulk capacitors; recommended to place 0.1μF and 0.01μF multilayer ceramic SMT capacitors in parallel between each power pin and ground, positioned as close to the power pins as possible

Key features

  • LVDS Signaling
  • 3.3V or 5.0V operation
  • Low power CMOS design
  • Balanced Output Impedance
  • Glitch free power up/down (Driver disabled)
  • High Signaling Rate Capacity (above 100 Mbps)
  • Ultra Low Power Dissipation
  • ±1V Common- Mode Range
  • ±100mV Receiver Sensitivity
  • Product offered in SOIC and TSSOP packages
  • Flow- Through Pin Out
  • Industrial Temperature Range Operation

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