H5TC4G63EFR-RDAR

The H5TC4G83EFR-xxA(I,L,J,K),H5TQC4G63EFR-xxA(I,L,J,K) are a 4Gb low power Double Data Rate III (DDR3L) Synchronous DRAM, ideally suited for the main memory applications which requires large memory density, high bandwidth and low power operation at 1.35V. DDR3L SDRAM provides backward compatibility with the 1.5V DDR3 based environment without any changes. 4Gb DDR3L SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the clock (falling edges of the clock), data, data strobes and write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched to achieve very high bandwidth.

Key features

• VDD = VDDQ = 1.35V + 0.100 / - 0.067V
• Fully differential clock inputs (CK, CK) operation
• Differential Data Strobe (DQS, DQS)
• On chip DLL align DQ, DQS and DQS transition with CK transition
• DM masks write data-in at the both rising and falling edges of the data strobe
• All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock
• Programmable CAS latency 5, 6, 7, 8, 9, 10, 11 and 13 supported
• Programmable additive latency 0, CL - 1, and CL - 2 supported
• Programmable CAS Write latency (CWL) = 5, 6, 7, 8
• Programmable burst length 4/8 with both nibble sequential and interleave mode
• BL switch on the fly
• 8 banks
• Average Refresh Cycle (Tcase of 0 ℃ ~ 95 ℃):
• 7.8 μs at 0 ℃ ~ 85 ℃
• 3.9 μs at 85 ℃ ~ 95 ℃
• 1.95 μs at 85 ℃ ~ 95 ℃
• Commercial Temperature (0 ℃ ~ 95 ℃)
• Industrial Temperature (-40 ℃ ~ 95 ℃)
• Automotive Temperature (-40 ℃ ~ 105 ℃)
• JEDEC standard 78ball FBGA(x8), 96ball FBGA (x16)
• Driver strength selected by EMRS
• Dynamic On Die Termination supported
• Asynchronous RESET pin supported
• ZQ calibration supported
• TDQS (Termination Data Strobe) supported (x8 only)
• Write Levelization supported
• 8 bit pre - fetch