TL032CDR

The TL03x series JFET-input op amps offer improved DC and AC performance compared to the TL06x series low-power BiFET op amps. On-chip zener offset voltage trimming achieves accuracy levels as low as 1.5 mV (TL031A), enhancing precision in DC-coupled applications. TI's improved BiFET process and optimized design also increase bandwidth and slew rate without increasing power consumption. BiFET op amps provide the inherently high input impedance of JFET input transistors without sacrificing the output drive capability of bipolar amplifiers. The higher input impedance makes TL03x amplifiers better suited for interfacing with high-impedance sensors or extremely low-level AC signals. These devices also inherently offer better AC response than bipolar or CMOS devices with comparable power consumption. The TL03x series is optimized for micropower operation while improving upon the performance of the TL06x series. Designers requiring significantly faster AC response can select the TLE206x series low-power BiFET op amps. Since BiFET op amps are designed for dual-supply operation, care must be taken to observe common-mode input voltage limits and output swing requirements when operating from a single supply. Input signals require DC biasing, and loads should be terminated to a virtual ground node at the supply midpoint. The TLE2426 integrated virtual ground generator is useful when driving BiFET amplifiers from a single supply. TL03x devices are fully specified at ±15 V and ±5 V. For low-voltage and/or single-supply system applications, the LinCMOS series op amps (prefixed TLC) are recommended. When converting from BiFET amplifiers to CMOS amplifiers, particular attention should be paid to slew rate, bandwidth requirements, and output loading. C-suffix devices have an operating temperature range of 0°C to 70°C. I-suffix devices have an operating temperature range of −40°C to 85°C.

Applications

• DC-coupled applications
• High-impedance sensor interfaces
• Ultra-low-level AC signal applications
• Existing circuit upgrades
• New product designs

Key features

• Low power consumption
• On-chip offset voltage trimming for improved DC performance
• Higher slew rate and bandwidth without additional power consumption
• TSSOP package for space-constrained designs