Varnitronics
H9HCNNNBKUMLXR-NEE HYNIX
HYNIX

H9HCNNNBKUMLXR-NEE

16Gbit 4.266GHz LPDDR4 SDRAM FBGA-200(10x15) Memory RoHS

FBGA-200(10x15)ROHS CompliantActive

LPDDR4 16Gb

Manufacturer
HYNIX
Manufacturer part #
H9HCNNNBKUMLXR-NEE
Store part #
C21912322
Package / case
FBGA-200(10x15)
Category
Memory
Packaging
Tray
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

1,400 in stock

#C21912322

Stock & price checked 5 days ago

QuantityUnit pricePack price
1+₹8,709.63₹8,709.63
30+₹8,243.43₹2,47,302.90

1 × ₹8,709.63

₹8,709.63

excl. GST

₹10,277.36 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 7–10 working days
  • GST invoice with every order
  • Standard pack: 120 per tray

H9HCNNNBKUMLXR-NEE

₹8,709.63 for 1 + GST

Specifications

Operating Temperature
-25℃~+85℃
Features
Auto self-refresh;Auto precharge function;Asynchronous reset function;Write leveling function;ZQ calibration function
Refresh Current
330uA
Memory Size
16Gbit
Voltage - Supply
7mA;1.06V~1.17V;1.7V~1.95V
Clock Frequency
4.266GHz
Memory Format
LPDDR4 SDRAM

Packaging & compliance

RoHS
ROHS Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tray
Standard pack
120 / Tray
Sold per
Piece
Minimum order
1
Unit weight
0.25 g

Overview

LPDDR4-SDRAM is a high-speed synchronous DRAM device internally configured with either 1 or 2 channels. Single-channel is comprised of 8-banks with from 1 Gb to 16 Gb per channel density. Dual-channel is comprised of 8-banks with from 2 Gb to 32 Gb per channel density. LPDDR4 devices use multi cycle of single data rate architecture on the Command/Address (CA) bus to reduce the number of input pins in the system. The 6-bit CA bus contains command, address and bank information. Each command uses two clock cycles, during which command information is transferred on positive edge of the corresponding clock. These devices also use a double data rate architecture on the DQ pins to achieve high speed operation. The double data rate architecture is essentially an 16n prefetch architecture with an interface designed to transfer two data bits per DQ every clock cycle at the I/0 pins. Read and write accesses to the LPDDR4 SDRAMs are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Prior to normal operation, the LPDDR4 SDRAM must be initialized.

Key features

  • VDD1 = 1.8V (1.7V to 1.95V)
  • VDD2 = 1.1V (1.06V to 1.17V)
  • VDD2, VDDCA and VDDQ = 1.1V (1.06 to 1.17)
  • VSSQ terminated DQ signals (DQ, DQS_t, DQS_c, DMI)
  • Single data rate architecture for command and address; all control and address latched at rising edge of the clock
  • Double data rate architecture for data Bus; two data accesses per clock cycle
  • Differential clock inputs (CK_t, CK_c)
  • Bi-directional differential data strobe (DQS_t, DQS_c)
  • Source synchronous data transaction aligned to bi-directional differential data strobe (DQS_t, DQS_c)
  • DMI pin support for write data masking and DBIdc functionality
  • Programmable RL (Read Latency) and WL (Write Latency)
  • Burst length: 16 (default), 32 and On-the-fly; On the fly mode is enabled by MRS
  • Auto refresh and self refresh supported
  • All bank auto refresh and directed per bank auto refresh supported
  • Auto TCSR (Temperature Compensated Self Refresh)
  • PASR (Partial Array Self Refresh) by Bank Mask and Segment Mask
  • Background ZQ Calibration

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