SN74AUP3G17RSER

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire V(CC) range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity. The SN74LVC3G17 contains three buffers and performs the Boolean function Y = A. The device functions as three independent buffers but, because of Schmitt action, it may have different input threshold levels for positive-going (V(T+)) and negative-going (V(T-)) signals. NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using I(off). The I(off) circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Applications

• Point-to-point applications
• Battery-powered portable device applications

Key features

• Available in the Texas Instruments NanoStar Package
• Low Static-Power Consumption (I(CC)=0.9 μA Maximum)
• Low Dynamic-Power Consumption (C(pd)=4.3 pF Typ at 3.3 V)
• Low Input Capacitance (C(i)=1.5 pF Typical)
• Low Noise – Overshoot and Undershoot < 10% of V(CC)
• I(off) Supports Partial-Power-Down Mode Operation
• Wide Operating V(CC) Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• t(pd)=5.1 ns Maximum at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22: 2000-V Human-Body Model (A114-B, Class II), 1000-V Charged-Device Model (C101)