Varnitronics
SN74AUP1G17DBVR TI
TI

SN74AUP1G17DBVR

Schmitt trigger 0.8V~3.6V 1 1 3ns@3.3V,5pF SOT-23-5 Buffers, Drivers, Receivers, Transceivers RoHS

SOT-23-5ROHS3 CompliantActive

Low-Power Single Schmitt-Trigger Buffer

Manufacturer
TI
Manufacturer part #
SN74AUP1G17DBVR
Store part #
C183012
Package / case
SOT-23-5
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

8,460 in stock

#C183012

Stock & price checked 33 h ago

QuantityUnit pricePack price
5+₹40.30₹201.50
50+₹31.33₹1,566.50
150+₹27.49₹4,123.50
500+₹22.70₹11,350.00
3,000+₹20.57₹61,710.00
6,000+₹19.29₹1,15,740.00

5 × ₹40.30

₹201.50

excl. GST

₹237.77 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 7–10 working days
  • GST invoice with every order
  • Standard pack: 3,000 per reel

SN74AUP1G17DBVR

₹201.50 for 5 + GST

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Specifications

Function
Power-off isolation
Current - Output High(IOH)
4mA
Input type
Schmitt trigger
Series
74AUP
Voltage - Supply
0.8V~3.6V
Current - Output Low(IOL)
4mA
Output Type
Push-pull
Number of Bits per Element
1
Channel Type
Unidirectional
Number of Elements
1
Operating Temperature
-40℃~+85℃
Quiescent Supply Current
900nA
Propagation Delay
3ns@3.3V,5pF

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
Moisture sensitivity
MSL 1 (unlimited)
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
3,000 / Reel
Sold per
Piece
Minimum order
5 (multiples of 5)
Unit weight
0.033 g

Overview

The AUP family of devices is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see AUP – The LowestPower Family and Excellent Signal Integrity). This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input. NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

Applications

  • Grid Infrastructure
  • PC & Notebooks
  • Tablets
  • Factory Automation & Control
  • Gaming Server

Key features

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22: 2000-V Human-Body Model (A114-B, Class II), 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption (IC C = 0.9 μA Maximum)
  • Low Dynamic-Power Consumption (ΔCpd = 4.4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot < 10% of VCC
  • Supports Partial-Power-Down Mode Operation
  • Includes Schmitt-Trigger Inputs
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Δtpd = 5.1 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications

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